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          Group Structure

          • ASM Pacific Technology
              • Wire bonders
              • Die bonders
              • Encapsulation solutions
              • Test handlers
              • Clip bonders,
              • CIS ?equipment
              • TCB bonders
              • Flip chip bonders
              • Mold Under Fill (MUF)
              • Panel molding
              • Laser grooving and dicing
              • Leadframes
              • Advanced packaging materials (molded interconnect substrates)
              • Assembly line solutions
              • DEK printing systems
              • SIPLACE placement systems
              • ASM smart factory tools & services
          久草大香蕉